The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 04, 2005
Filed:
Aug. 29, 2003
Luu Thanh Nguyen, Sunnyvale, CA (US);
Ken Pham, San Jose, CA (US);
Peter Deane, Los Altos, CA (US);
William Paul Mazotti, San Martin, CA (US);
Bruce Carlton Roberts, San Jose, CA (US);
Jia Liu, San Jose, CA (US);
Luu Thanh Nguyen, Sunnyvale, CA (US);
Ken Pham, San Jose, CA (US);
Peter Deane, Los Altos, CA (US);
William Paul Mazotti, San Martin, CA (US);
Bruce Carlton Roberts, San Jose, CA (US);
Jia Liu, San Jose, CA (US);
National Semiconductor Corporation, Santa Clara, CA (US);
Abstract
The present invention provides a technique for manufacturing a low cost device that provides a true die to external fiber optic connection. Specifically, the present invention relates to several techniques for joining an optical device package to a semiconductor device package. The first technique involves using wirebond studs and an adhesive material, the second technique involves the use of an anisotropic conductive film, and the third technique involves the use of solder material. Each of these techniques provides high levels of thermal, electrical and optical performance. The methods apply to optical sub-assembly and chip sub-assembly interfaces in transceivers, transmitters, as well as receivers for opto-electronic packages.