The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 04, 2005
Filed:
Mar. 05, 2003
Applicants:
Kazuhiro Iizuka, Yokohama, JP;
Shinya Takyu, Kitakatsushika-gun, JP;
Inventors:
Kazuhiro Iizuka, Yokohama, JP;
Shinya Takyu, Kitakatsushika-gun, JP;
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2144 ; H01L 2148 ; H01L 2150 ;
U.S. Cl.
CPC ...
Abstract
A bump is formed on at least one of a semiconductor chip and printed circuit board. A sealing material is applied to the surface of one of the semiconductor chip and printed circuit board. The printed circuit board is flip-chip-connected to the semiconductor chip via the sealing material while ultrasonic waves are applied to the printed circuit board to promote bonding by the bump.