The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 04, 2005
Filed:
Dec. 09, 2002
Applicants:
Junichi Hikita, Kyoto, JP;
Koji Yamamoto, Kyoto, JP;
Inventors:
Junichi Hikita, Kyoto, JP;
Koji Yamamoto, Kyoto, JP;
Assignee:
ROHM Co., Ltd., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2144 ;
U.S. Cl.
CPC ...
Abstract
A semiconductor device having a plurality of semiconductor chips respectively joined to predetermined positions on a surface of a solid, and a frame holding the plurality of semiconductor chips in a relative positional relationship corresponding to joint positions on the surface of the solid. The solid may be another semiconductor chip or a wiring board. The plurality of semiconductor chips may be bonded to a surface, opposite to the surface, of the solid, of the frame. The plurality of semiconductor chips may be respectively fitted in through holes formed in the frame.