The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 04, 2005
Filed:
Dec. 20, 2001
Ching-pang Lee, Cincinnati, OH (US);
Melvin Robert Jackson, Niskayuna, NY (US);
Stephen Joseph Ferrigno, Cincinnati, OH (US);
Gary Edward Trewiler, Loveland, OH (US);
Mark Daniel Gorman, West Chester, OH (US);
Ching-Pang Lee, Cincinnati, OH (US);
Melvin Robert Jackson, Niskayuna, NY (US);
Stephen Joseph Ferrigno, Cincinnati, OH (US);
Gary Edward Trewiler, Loveland, OH (US);
Mark Daniel Gorman, West Chester, OH (US);
General Electric Company, Schenectady, NY (US);
Abstract
A protected article includes a nickel-base superalloy substrate, an interlayer overlying the substrate, and a protective layer overlying the interlayer. The protective layer has a composition comprising at least one of rhodium, platinum, palladium, and ruthenium. In one composition, palladium is present in an amount of from about 1 to about 41 atomic percent; platinum is present in an amount of about (40+atomic percent palladium) atomic percent for palladium ranging from about 1 atomic percent to about 14 atomic percent and up to about 54 atomic percent for palladium ranging from about 15 atomic percent up to about 41 atomic percent; rhodium is present in an amount of at least about 24 atomic percent; zirconium, hafnium, titanium, and mixtures thereof are present in an amount of from zero up to about 5 atomic percent; and ruthenium is present in an amount of from zero up to about 5 atomic percent, balance impurities. The interlayer has a coefficient of thermal expansion intermediate between that of the substrate and that of the protective layer. The protected article is fabricated by furnishing the substrate, applying the interlayer over the substrate, and applying the protective layer over the interlayer. The application of the protective layer may be, for example, by welding or attachment of a solid piece.