The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 04, 2005
Filed:
Apr. 20, 2001
Kazuya Goto, Nagoya, JP;
Shigetsugu Hayashi, Nagoya, JP;
Tadayoshi Saito, Nagoya, JP;
Takashi Kaneko, Nagoya, JP;
Kazutami Mitani, Nagoya, JP;
Koki Wakabayashi, Nagoya, JP;
Yasuo Takagi, Nagoya, JP;
Kazuya Goto, Nagoya, JP;
Shigetsugu Hayashi, Nagoya, JP;
Tadayoshi Saito, Nagoya, JP;
Takashi Kaneko, Nagoya, JP;
Kazutami Mitani, Nagoya, JP;
Koki Wakabayashi, Nagoya, JP;
Yasuo Takagi, Nagoya, JP;
Mitsubishi Rayon Co., Ltd., Tokyo, JP;
Abstract
Epoxy resin compositions comprising (a) an epoxy resin, (b) a latent curing agent with curing power at 100° C. or below and (c) an aromatic amine-based curing agent and/or an alicyclic amine-based curing agent, which are curable in two stages, or epoxy resin compositions further comprising (d) a curing accelerator, as well as a prepregs comprising reinforcing fiber materials impregnated with the epoxy resin compositions. The compositions give die-releasable cured products by primary curing at low temperature, give highly heat-resistant cured products by secondary curing, and exhibit satisfactory stability at room temperature.