The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 04, 2005
Filed:
Jul. 03, 2001
Daishi Saiki, Tokyo, JP;
Hirohide Matsuhisa, Kanagawa, JP;
Naohisa Kumagai, Ibaraki, JP;
Izumi Uraki, Tokyo, JP;
Daishi Saiki, Tokyo, JP;
Hirohide Matsuhisa, Kanagawa, JP;
Naohisa Kumagai, Ibaraki, JP;
Izumi Uraki, Tokyo, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
It is an object of this invention to provide a multilayered structure molded product formable by reusing a resin molded product. To achieve this object, a multilayered structure resin molded product including a core layer and a skin layer is molded using a pulverized resin material, which is formed by pulverizing a molded product molded from a thermoplastic resin material, as a resin material for forming the core layer, and a virgin material as a resin material for forming the skin layer.