The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 04, 2005

Filed:

Jul. 03, 2001
Applicants:

Daishi Saiki, Tokyo, JP;

Hirohide Matsuhisa, Kanagawa, JP;

Naohisa Kumagai, Ibaraki, JP;

Izumi Uraki, Tokyo, JP;

Inventors:

Daishi Saiki, Tokyo, JP;

Hirohide Matsuhisa, Kanagawa, JP;

Naohisa Kumagai, Ibaraki, JP;

Izumi Uraki, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 302 ; B32B 330 ; B60R 1300 ;
U.S. Cl.
CPC ...
Abstract

It is an object of this invention to provide a multilayered structure molded product formable by reusing a resin molded product. To achieve this object, a multilayered structure resin molded product including a core layer and a skin layer is molded using a pulverized resin material, which is formed by pulverizing a molded product molded from a thermoplastic resin material, as a resin material for forming the core layer, and a virgin material as a resin material for forming the skin layer.


Find Patent Forward Citations

Saiki, Daishi. (2005). Multilayered structure resin molded product and method of manufacturing multilayered structure resin molded product (U.S. Patent No. 6838131). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6838131

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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