The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 04, 2005

Filed:

Nov. 08, 2002
Applicants:

Gregory Lynn Malchow, Oshkosh, WI (US);

Daniel Hoo, Appleton, WI (US);

Timothy James Blenke, Neenah, WI (US);

Jeffry Jon Radke, Menasha, WI (US);

Inventors:

Gregory Lynn Malchow, Oshkosh, WI (US);

Daniel Hoo, Appleton, WI (US);

Timothy James Blenke, Neenah, WI (US);

Jeffry Jon Radke, Menasha, WI (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 3126 ;
U.S. Cl.
CPC ...
Abstract

Bonded composites, absorbent articles comprising such bonded composites, and processes for bonding thin-section elements. The bonded composite has first and second thin-section elements bonded to each other, at least in part by bond elements and at least in part by adherent material. The adherent material is disposed between the first and second thin-section elements proximate and about the bond elements. The adherent material, at least in part, bonds the thin-section elements to each other at loci of the adherent material. The bond patterns are arranged and configured to preferentially direct stresses imposed on the bond pattern, inwardly into the interior of the bond pattern for distribution, dissipation, and termination.


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