The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 28, 2004
Filed:
Feb. 13, 2003
Applicant:
Inventors:
Mark R. Boone, Gilbert, AZ (US);
Andreas A. Fenner, Chandler, AZ (US);
Juan G. Milla, Mesa, AZ (US);
Lary R. Larson, Gold Canyon, AZ (US);
Assignee:
Medtronic, Inc., Minneapolis, MN (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/348 ; H01L 2/3552 ;
U.S. Cl.
CPC ...
H01L 2/348 ; H01L 2/3552 ;
Abstract
A flip-chip package comprises a substrate having at least one layer and a component flip-chip mounted to the substrate, the component having a field termination ring. The flip-chip package further comprises a shield plane interposed between the at least one layer of substrate and the field termination ring.
Boone, Mark. (2004). High voltage flip-chip component package and method for forming the same (U.S. Patent No. 6836022). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6836022
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile