The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 28, 2004
Filed:
Jan. 22, 2003
Applicant:
Inventors:
Ching-Hsiang Cheng, Palo Alto, CA (US);
Arif S. Ergun, Mountain View, CA (US);
Butrus T. Khuri-Yakub, Palo Alto, CA (US);
Assignee:
The Board of Trustees of the Leland Stanford Junior University, Stanford, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/940 ;
U.S. Cl.
CPC ...
H01L 2/940 ;
Abstract
A wafer with through wafer interconnects. The wafer includes spaced through wafer vias which extend between the back side and front side of the wafer. A conductor within each of said vias connects to front and back side pads. Functions associated with said conductor and said pads provide a depletion region in the wafer between the pads and wafer or pads and conductor and the wafer.