The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 28, 2004
Filed:
Nov. 18, 2002
Applicant:
Inventors:
Michael Kistner, Bamberg, DE;
Reinhold Dillig, Memmelsdorf, DE;
Sebastian Raith, Erlangen, DE;
Manfred Loddenkoetter, Ibbenbueren, DE;
Reinhold Bayerer, Warstein, DE;
Assignee:
EUPEC Europaeische Gesellschaft fuer Leistungshalbleiter mbH & Co. KG, Warstein-Belecke, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/900 ; H01L 2/3053 ; H05K 1/18 ;
U.S. Cl.
CPC ...
H01L 2/900 ; H01L 2/3053 ; H05K 1/18 ;
Abstract
A power semiconductor module contains a power component and a sensor component. The power component is disposed on a first substrate. The sensor component is electrically and/or mechanically insulated from the power component by being disposed on an individual, separate second substrate. In this manner, disturbances of the sensor system section caused by the power section and its operation can be avoided particularly reliably.