The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 2004

Filed:

Jan. 31, 2003
Applicant:
Inventors:

Hiroshi Toyoshima, Akiruno, JP;

Atsuhiro Hayashi, Ome, JP;

Takemi Negishi, Honjyo, JP;

Takashi Uehara, Tachikawa, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/710 ; H01L 2/352 ;
U.S. Cl.
CPC ...
H01L 2/710 ; H01L 2/352 ;
Abstract

A semiconductor integrated circuit device, which is intended to prevent the characteristic degradation, includes multiple limiter circuits which are laid out by being scattered across a semiconductor substrate to produce an internal power voltage of a certain voltage level. Each limiter circuit is laid out so as to have its transistor formation area located just beneath the formation area of a bump electrode which puts in an externally supplied power voltage. The scattered layout of limiter circuits avoids the concentration of current to one limiter circuit and alleviates the harmful heat-up of the limiter circuits and their periphery. The shorter wiring length from the bump electrode to the transistor results in a smaller wiring resistance, alleviating the power voltage drop on the wiring.


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