The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 2004

Filed:

Aug. 14, 2002
Applicant:
Inventor:

Ju-Il Lee, Kyoungki-do, KR;

Assignee:

Hynix Semiconductor Inc., Gyunggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/100 ;
U.S. Cl.
CPC ...
H01L 2/100 ;
Abstract

The disclosed method provides a method capable of removing dangling bonds generated on a surface of photodiode. The method includes steps of: forming a photodiode in a semiconductor substrate; forming a transfer transistor, a reset transistor, a drive transistor and a select transistor on the semiconductor substrate; forming a first interlayer insulating layer on the semiconductor substrate, wherein the first interlayer insulating layer contains hydrogen ions; forming a second interlayer insulating layer on the first interlayer insulating layer; and flattening the second interlayer insulating layer by flowing and simultaneously diffusing the hydrogen ions into a surface of the photodiode.


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