The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6833997 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 21, 2004

Filed:

May. 27, 2003
Applicant:
Inventors:

James L. Jones, III, White Lake, MI (US);

Truong Nguyen, Canton, MI (US);

Martin Eugene Beckman, Canton, MI (US);

Assignee:

Yazaki North America, Inc., Canton, MI (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/02 ; H05K 7/06 ; H05K 7/08 ; H05K 7/10 ;
U.S. Cl.
CPC ...
H05K 7/02 ; H05K 7/06 ; H05K 7/08 ; H05K 7/10 ;
Abstract

A circuitboard assembly in which power carrying circuitboard traces between MOSFETs or the like and edge terminals are replaced with metal leadframe structures which also serve to perform a heat dissipation function. Each of the leadframes comprises a first planar portion which is bonded by a thermally conductive epoxy to the top surface of a MOSFET and a second elevated planar portion which extends parallel to but above the circuitboard surface into contact with an edge-mounted terminal header. The leadframes may be provided with support legs as well as additional heat dissipating fins.


Find Patent Forward Citations

Jones, III, James. (2004). Combination terminal/leadframe for heat sinking and electrical contacts (U.S. Patent No. 6833997). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6833997

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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