The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 21, 2004
Filed:
Apr. 19, 2002
Noritaka Anzai, Tokyo, JP;
Makoto Terui, Yamanashi, JP;
Oki Electric Industry Co., Ltd., Tokyo, JP;
Abstract
A resin-molded semiconductor device capable of preventing an adhesive from flowing out along conductive paths from where electronic parts are attached on the conductive paths when the electronic parts are fixed to the conductive paths of a semiconductor package. The semiconductor device comprises a semiconductor chip ( ), a plurality of conductive paths ( ) connected to the semiconductor chip through conductive wires ( ) extending from said chip, and an electronic part ( ) mounted in such a manner as to electrically connect to two pieces of the conductive paths through the intermediary of an adhesive showing fluidity before hardening and molded in one body the semiconductor chip. In the conductive path, a raised portion is provided to prevent the adhesive from flowing out along the conductive path in the longitudinal direction of the conductive path before the adhesive hardens.