The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 21, 2004
Filed:
Jan. 25, 2002
Myong Ryong Kim, Anyang, KR;
Tae Hee Jeong, Seongnam, KR;
LG Electronics Inc., Seoul, KR;
Abstract
A thin film bonding method for bonding a thin film to an target surface by using an adhesive agent includes the steps of: applying the adhesive agent on the target surface and mounting the thin film on the adhesive agent; applying a a fluid pressure on the target surface and the thin film from a central portion to an circumference according to lapse of time, so as to allow the thin film and the target surface to be bonded partially; and hardening the adhesive agent. The compressive force using the fluid having a magnetic force in the thin film bonding proceeds in a spiral form from the central portion to the circumference of the disk according to lapse of time, so that the air trap existing in the adhesive agent can be effectively removed, and thus, the flatness of the disk can be prevented from degradation due to the air trap.