The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 21, 2004
Filed:
Dec. 30, 2002
Junichi Koyama, Kanagawa, JP;
Kazunari Imai, Kanagawa, JP;
Osamu Hayama, Kanagawa, JP;
Hitoshi Omata, Kanagawa, JP;
Amada Company, Limited, Kanagawa, JP;
Abstract
A bending apparatus for bending a workpiece W according to cooperation of a punch P and a die D previously carries out various step bending or makes simulation of step bending, and calculates an approximation formula based on a correlation between a ratio % of a one-sided elongation value &agr; to a plate thickness t and a step bending angle &thgr; based on a relationship among the plate thickness t, the step bending angle &thgr; and the one-sided elongation value &agr; of the workpiece W so as to store the formula as a database. The more accurate one-sided elongation value &agr; of the step bending is calculated by small parameters including only two data including the plate thickness t and the step bending angle &thgr; previously input at the time of actual bending based on the approximation formula in the data base so that the bending is carried out easily.