The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 21, 2004

Filed:

Oct. 26, 2001
Applicant:
Inventors:

Keiji Nakagawa, Yokosuka, JP;

Yukihiro Honda, Yokosuka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F15B 7/08 ;
U.S. Cl.
CPC ...
F15B 7/08 ;
Abstract

An upper die and a lower die are combined. A core for molding a concavity and another core are combined with the combined upper die and the lower die at respective prescribed positions. A core for through-hole molding is constructed by the junction of cores that are severally formed with the upper die and the lower die integrally on the extension line of the central axis of the core for molding a concavity. A through-hole is molded with the core for through-hole molding. A concavity in which a valve mechanism is equipped and a communicating hole through which the concavity communicates with the through-hole are molded with the core for molding a concavity. The core for through-hole molding includes an impact hole, in which a tip of the core for molding a concavity is impacted.


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