The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 2004
Filed:
Mar. 26, 2003
Yuji Nishitani, Kanagawa, JP;
Tsuyoshi Ogawa, Kanagawa, JP;
Hiroshi Asami, Shizuoka, JP;
Akihiko Okubora, Kanagawa, JP;
Sony Corporation, Tokyo, JP;
Abstract
A circuit substrate device composed of a circuit unit and a multi-layer wiring substrate in which a pattern conductor of the circuit unit may be prevented from being warped or inundated. The circuit substrate device includes a circuit unit having a pattern conductor formed by a thin film technique, and an insulating layer, and a multi-layer wiring substrate having a connecting terminal portion exposed from its major surface. The circuit unit is formed on a dummy substrate. The circuit unit is connected to the multi-layer wiring substrate so that the pattern conductor is connected to the connecting terminal portion . The dummy substrate is then removed to give a structure comprised of the circuit unit formed on the multi-layer wiring substrate . The pattern conductor of the circuit unit is freed of warping or inundations along the direction of thickness of the circuit unit