The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 2004
Filed:
Feb. 25, 2003
Applicant:
Inventor:
Tomoyuki Fujii, Nagoya, JP;
Assignee:
NGK Insulators, Ltd., Nagoya, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/973 ; H01L 2/3495 ; H01L 2/312 ; H01L 2/1461 ; H01L 2/1302 ;
U.S. Cl.
CPC ...
H01L 2/973 ; H01L 2/3495 ; H01L 2/312 ; H01L 2/1461 ; H01L 2/1302 ;
Abstract
An object of the present invention is to provide a novel semiconductor mounting system having a semiconductor mounting member, a metal member and a joining layer joining the mounting and metal members, to improve the flatness of a mounting surface and to control the temperature on the surface of a semiconductor. A semiconductor mounting system has a semiconductor mounting member a metal member and a joining layer joining the mounting member and metal member The metal member has a surface mounting a semiconductor. The adhesive sheet has a resin matrix and a filler dispersed in the resin matrix