The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 2004
Filed:
Sep. 19, 2002
Hirofumi Makimoto, Kumamoto, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A semiconductor wafer and a substrate are positioned facing each other, and electrode pads of individual semiconductor chips and connecting electrode pads of package bases are bonded simultaneously. The semiconductor wafer and the substrate are cut at the same time and divided into semiconductor chips. After expanding spaces between the divided semiconductor chips a predetermined width in an expanding process, a sealing resin is applied so that the large number of semiconductor chips and package bases are sealed with the resin at the same time. Then the semiconductor chips are cut and divided into separate pieces. Thus, semiconductor devices sealed with a resin are formed.