The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 2004
Filed:
Apr. 18, 2003
Girish S. Patil, Lexington, KY (US);
Brian C. Hart, Georgetown, KY (US);
Lexmark International, Inc., Lexington, KY (US);
Abstract
A radiation curable resin formulation suitable for planarizing an ink jet heater chip. The resin formulation includes a multifunctional epoxy component, a difunctional epoxy component, a silane coupling agent, an aryl sulfonium salt photoinitiator, and a non-photoreactive solvent. The resin formulation is substantially devoid of acrylate polymer components. Radiation curable resins according to the invention exhibit enhanced adhesion with the nozzle plate adhesive thereby reducing the incidence of delamination between the nozzle plate and a semiconductor chip containing the resin layer. Another advantage is that the resin layer, according to the invention, reduces pigment flocculation on the surface of the resin layer when using pigment-based ink jet inks.