The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 2004
Filed:
Feb. 05, 2003
Carl T. Ito, Scottsdale, AZ (US);
Other;
Abstract
A solder ball dispenser ( ) has feeder unit, head unit chambers ( ) and a pneumatic singulator ( ). Solder balls ( ) are mobilized in the chambers by moving air. The solder ball dispenser receives a continuous supply of unorganized solder balls and arranges them in a single stack ( ). The singulator ejects the balls one at a time to a target device such as a Ball Grid Array. The dispenser has a plurality of conduits ( ) for applying one of air pressure and vacuum to various points of the chambers and the channel. Solder balls are transported through the dispenser and ejected from the dispenser by the programmed application of air pressure and vacuum. The trajectory of each solder ball is stopped before moving to a next position in the pneumatic singulator. No solid object causes solder balls to move within the dispenser or to be ejected from the dispenser.