The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 2004
Filed:
May. 08, 2003
Applicant:
Inventors:
Wilfried Reschnar, Schozach, DE;
Stephan Borges, Ludwigsburg, DE;
Stephan Leuthner, Stuttgart, DE;
Juergen Hackenberg, Sachsenheim, DE;
Franz Wetzl, Mundelsheim, DE;
Assignee:
Robert Bosch GmbH, Stuttgart, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21D 5/302 ; B23K 5/22 ;
U.S. Cl.
CPC ...
B21D 5/302 ; B23K 5/22 ;
Abstract
A method for producing a component out of stacked plates ( ) soldered to one another, into at least some of which recesses ( ) are made, is proposed, in which at least one solder layer ( ) is provided between the plates ( ) for a solder diffusion process. According to the invention, the plates ( ), with solder layers ( ) between them, are stacked on one another and compressed in the cold state before the solder diffusion process. With this provision, the use of complicated pressing tools in the actual solder diffusion process is avoided.