The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 07, 2004

Filed:

Nov. 27, 2001
Applicant:
Inventors:

Kazuyoshi Honda, Takasuki, JP;

Noriyasu Echigo, Kobe, JP;

Yoshiaki Kai, Neyagawa, JP;

Masaru Odagiri, Hyogo, JP;

Nobuki Sunagare, Matsue, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/228 ;
U.S. Cl.
CPC ...
H01G 4/228 ;
Abstract

Resin thin films ( ) and metal thin films ( ) are layered in alternation. The metal thin films are set back from the peripheral edges of the resin thin films ( ). Via holes ( ) penetrating the layered product in the layering direction are formed and filled with conductive material ( ). The conductive material ( ) electrically connects the metal thin films ( ) among one another. The metal thin films are not exposed at the periphery, so that corrosion of the metal thin films is not likely to occur. Furthermore, cutting of the metal thin films during the manufacturing process is avoided.


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