The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 2004
Filed:
Jan. 24, 2002
Applicant:
Inventor:
Tomoyuki Furuhata, Sakata, JP;
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/352 ; H01L 2/940 ;
U.S. Cl.
CPC ...
H01L 2/352 ; H01L 2/940 ;
Abstract
A semiconductor device may include a protective insulation layer , a pad opening section provided in the protective insulation layer , and a wiring layer which the pad opening section reaches. First and second wiring layers and are provided at levels below the wiring layer which the pad opening section reaches. The first and second wiring layers and provided at levels below the wiring layer which the pad opening section reaches are formed outside a region of the pad opening section as viewed in a plan view.