The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 2004
Filed:
Nov. 12, 2002
Takao Akai, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
The present invention relates to a manufacturing method of a semiconductor device having a lid implemented on a semiconductor chip. The semiconductor device and the semiconductor device unit are capable of maintaining high thermal dissipation efficiency as well as the semiconductor chip having improved reliability. Specifically, upon manufacturing the above semiconductor device having a semiconductor chip mounted on a substrate and a lid thermally connected to this semiconductor chip, a stiffener, which controls the deformation of the semiconductor chip, is implemented on the side of the semiconductor chip that accommodates the lid; after which heating is performed so as to bond the semiconductor chip accommodating the stiffener to the substrate; followed by the bonding of the lid to the stiffener.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile