The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 2004
Filed:
May. 24, 2002
Applicant:
Inventors:
Assignee:
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/3495 ; H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/3495 ; H01L 2/348 ;
Abstract
A lead frame has a die pad portion supported internally of a framework portion by suspension leads and a plurality of leads each having one end connected to the framework portion and the other end opposed to the die pad portion. The die pad portion has a holding region formed from a part of an upper surface of the die pad portion which has been elevated above the remaining part of the upper surface. Openings are formed in the holding region to extend therethrough in a front-to-back direction of the die pad portion.
Araki, Masanao. (2004). Lead frame and a resin-sealed semiconductor device exhibiting improved resin balance, and a method for manufacturing the same (U.S. Patent No. 6828661). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6828661
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile