The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 2004
Filed:
May. 09, 2002
Norbert A. Schmitz, Roanoke, VA (US);
Richard J. Giacchino, Peabody, MA (US);
Wayne Struble, Franklin, MA (US);
M/A-Com, Inc., Lowell, MA (US);
Abstract
An integrated circuit package houses and connects to a die to form an integrated circuit with internal matching. The package comprises a lead frame comprising at least one transmission line, a die paddle, and at least one input lead and at least one output lead. Bond wires connect select locations along the at least one transmission line to ground through impedance matching circuit components located within the integrated circuit to provide an impedance matching network associated with at least one of the output leads. A plastic mold compound substantially encases the lead frame, while exposing the die paddle and the input/output leads. Incorporating the transmission line into the lead-frame avoids having to place the matching network outside of the integrated circuit package. That is, etching the lead frame to provide the transmission line, and placing components (e.g., capacitors, inductors, etc.) of the impedance transform matching circuit within the integrated circuit and connecting the components between select locations on the transmission line and ground is relatively inexpensive.