The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 2004
Filed:
Feb. 27, 2003
Applicant:
Inventors:
Kouya Takahashi, Tokyo, JP;
Natsuko Ishihara, Tokyo, JP;
Assignee:
Polymatech Co., Ltd, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08K 3/20 ;
U.S. Cl.
CPC ...
C08K 3/20 ;
Abstract
A heat conductive sheet comprising organic matrix and heat conductive filler contained in the organic matrix at a volume percent between 30% and 80%. The heat conductive filler comprises spherical shaped alumina grains which have an average grain diameter in a range between 50 &mgr;m and 80 &mgr;m. The heat conductive filler includes micro grains having a grain diameter of 30 &mgr;m or less at a proportion of 5 volume % or less with respect to the total amount of the spherical shaped alumina grains.