The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 07, 2004

Filed:

Mar. 07, 2002
Applicant:
Inventors:

Cuong Van Pham, San Diego, CA (US);

Jay DeAvis Baker, Dearborn, MI (US);

Mohan R. Paruchuri, Canton, MI (US);

Prathap Amervai Reddy, Farmington Hills, MI (US);

Vivek Amir Jairazbhoy, Farmington Hills, MI (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/34 ;
U.S. Cl.
CPC ...
H05K 3/34 ;
Abstract

A method for attaching an electronic die to a substrate is disclosed. Preferably, the method includes fixing the die to the substrate, interconnecting the electronic die to an at least one bonding pad on the substrate to form an electrical connection, coating the interconnects and the electronic die with an electrically insulating coating, and covering the electronic die with a low temperature melting metal. Thus, the method of the present invention improves the reliability of the electronic die.


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