The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 2004
Filed:
Apr. 05, 2003
Murata Manufacturing Co., LTD, Kyoto, JP;
Abstract
An electronic device includes a wiring substrate, an electronic component mounted on the wiring substrate by soldering, and a case fixed to the wiring substrate so as to cover the electronic component. The case is fixed to the wiring substrate via soldering, and the case and the electronic component are adhered to each other with an adhesive resin supplied through an opening provided in the upper surface of the case. The adhesive resin is applied so as not to contact the wiring substrate such that interface separation does not occur between the adhesive resin and the wiring substrate even when the solder for mounting the electronic component on the wiring substrate is melted and expanded in a solder reflow process. As a result, the generation of short circuiting between terminal electrodes of the electronic component, which is caused by the solder flowing in the portion of the interface separation, is prevented.