The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 30, 2004

Filed:

Aug. 08, 2003
Applicant:
Inventors:

Atsushi Nagai, Aichi, JP;

Minoru Sato, Tokyo, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/008 ; H01G 4/30 ; H01G 4/06 ;
U.S. Cl.
CPC ...
H01G 4/008 ; H01G 4/30 ; H01G 4/06 ;
Abstract

A ceramic electronic component ( ) having surface conductor films ( ) and side-surface conductor films ( ) excellent in burning shrinkage, bonding strength, solder heat resistance, solder wettability and the like. A method of producing a ceramic electronic component which uses a conductive paste containing as a main component Ag-based metal powder, the surface of the metal powder being coated with an organic metal compound or a metal oxide having as a constituting element any one selected from Al, Zr, Ti, Y, Ca, Mg and Zn, to form conductor films ( ) on a ceramic base material ( ). A side-surface conductor film-forming paste differs form a surface conductor film-forming paste in that (1) the former paste has a relatively small coating amount of the organic metal compound or metal oxide and/or (2) contains either at least one kind of inorganic oxide powder as an accessory composition or a comparatively high percentage of the inorganic oxide powder.


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