The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 2004
Filed:
Jul. 14, 2000
Applicant:
Inventors:
Shinji Takeda, Tsukuba, JP;
Takashi Masuko, Tsukuba, JP;
Masami Yusa, Shimodate, JP;
Yasuo Miyadera, Tsukuba, JP;
Mituo Yamasaki, Takahagi, JP;
Iwao Maekawa, Hitachi, JP;
Akio Kotato, Mito, JP;
Yuusuke Miyamae, Hitachi, JP;
Tadaji Satou, Takahagi, JP;
Makoto Saitou, Hitachi, JP;
Tooru Kikuchi, Hitachi, JP;
Akira Kageyama, Niiza, JP;
Aizou Kaneda, Yokohama, JP;
Assignee:
Hitachi Chemical Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/00 ;
U.S. Cl.
CPC ...
C08K 3/00 ;
Takeda, Shinji. (2004). Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device (U.S. Patent No. 6825249). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6825249
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile