The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 2004
Filed:
Feb. 08, 2001
Paul Mariaggi, Seyssuel, FR;
Dominique Audigier, Vourles, FR;
Frédérique Hauviller, Saint-Genis Laval, FR;
Institut Francais du Petrole, Rueil Malmaison Cedex, FR;
Abstract
A radially deployable flexible preform which, after deploying, forms a tubular structure that is curable by polymerization after positioning it in a well or in a line and moulds to the shape thereof after curing, comprises in its constitution at least one resin comprising in its chemical formula, at least one reactive multiple bond that is capable of subsequent reaction with compounds comprising in their constitution at least one terminal reactive multiple bond or a reactive multiple bond positioned at one end or the other of the molecular chain and/or on a pendant group. The long latent period heat curing resin has a glass transition temperature of at least 90° C. and can be associated with at least one polymerizable oligomer and/or at least one monomer comprising at least one multiple bond in its chemical formula. The resin can also be associated with drying reducers or flow regulators ensuring optimum retention of the fiber/matrix ratio during pressing occurring on deployment of the expandable preform. These compositions optionally comprise post-polymerization shrinkage reducers. Normally, an unsaturated polyester resin or a vinyl ester resin is used, or a mixture of resins usually containing at least one of these resins.