The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 30, 2004

Filed:

Nov. 13, 2002
Applicant:
Inventors:

Joung Soo Kim, Daejeon, KR;

Yun Soo Lim, Daejeon, KR;

Seong Sik Hwang, Daejeon, KR;

Moohong Seo, Daejeon, KR;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 3/56 ;
U.S. Cl.
CPC ...
C25D 3/56 ;
Abstract

Disclosed is a method of electroplating a Ni—Fe—P alloy using a sulfamate solution and, in particular, a method of electroplating a Ni—Fe—P alloy using a plating solution containing nickel sulfamate, iron sulfamate, phosphorous acid, and a buffer agent. The method is advantageous in that a residual stress of a deposited layer is very low and has stable mechanical properties, and excellent thermal and corrosion resistance because the deposited layer is obtained by electroplating the Ni—Fe—P alloy using the sulfamate solution useful in a high rate plating process. Furthermore, the method can be applied to various parent metals such as stainless steel, Inconel and iron alloys, and to various fields because the chemical compositions of the deposited layer are readily controlled by varying the concentration of the plating solution.


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