The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 2004
Filed:
Nov. 13, 2001
Richard Nicholas Whyne, Mechanicsburg, PA (US);
Benjamin Howard Mosser, III, Middletown, PA (US);
David Allison Trout, Wrightsville, PA (US);
Tyco Electronics Corporation, Middletown, PA (US);
Abstract
A terminal for use with a zero insertion force socket is disclosed which electrically connects a mating connector to a printed circuit board or the like. The terminal has a pin engaging portion which has a pair of nonsymmetrical contact arms which are positioned to make electrical engagement with the mating pin. A first contact arm of the pair of contact arms is configured to have a longer electrical path across which signals are transmitted than a second contact arm. The first contact arm also has a reduced cross section compared to the second contact arm, such that the first contact arm is configured to have a matched inductance to the second contact arm. A retention portion extends from the pin engaging portion. Side edges of the retention portion are dimensioned to create a frictional interference with side wall of a cavity of the socket. A mounting portion extends from the retention portion in an opposite direction from the pin engaging portion. The mounting portion has at least one resilient leg which extends from the retention portion to a solder pad which is soldered to a substrate. The solder pad is spaced from the retention portion a sufficient distance to allow the at least one resilient leg to provide the resilient characteristics required to allow the at least one resilient leg to resiliently compensate for misalignment or movement of the solder relative to the solder pad.