The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6824039 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 30, 2004

Filed:

Aug. 09, 2002
Applicant:
Inventors:

Ping Wu, Singapore, SG;

Kewu Bai, Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 3/102 ; C22C 1/300 ;
U.S. Cl.
CPC ...
B23K 3/102 ; C22C 1/300 ;
Abstract

Lead-free solder alloys based on a Sn—Ag—Mg system are disclosed. The alloy compositions have a melting temperature close to 183° C. and a similar surface tension to that of Sn—Pb solder, and can thus be a readily substituted for conventional Sn—Pb solders. P may be added to the alloy compositions to reduce its tendency of oxidation.


Find Patent Forward Citations

Wu, Ping. (2004). Lead free tin based solder composition (U.S. Patent No. 6824039). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6824039

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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