The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 23, 2004
Filed:
Jun. 13, 2002
Applicant:
Inventor:
Shigeki Kageyama, Tokyo, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/328 ;
U.S. Cl.
CPC ...
H01L 2/328 ;
Abstract
A semiconductor device includes a multiplayer substrate with a cavity, a semiconductor chip in the cavity, wiring lines with lands, a cover of a material, covering the semiconductor chip and having a protruding part, and chips bonded to the wirings lines with a solder having a low melting point. The protruding part has a height from the surface of the multiplayer substrate greater than the thickness of the wiring layer.
Kageyama, Shigeki. (2004). Semiconductor device (U.S. Patent No. 6822339). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6822339
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile