The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 23, 2004
Filed:
Aug. 20, 2001
Applicant:
Inventors:
Peter Lahnor, Dresden, DE;
Stephan Wege, Dresden, DE;
Assignee:
Infineon Technologies AG, Munich, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/1302 ;
U.S. Cl.
CPC ...
H01L 2/1302 ;
Abstract
The optimization of a CMP process provides the use of an auxiliary layer ( ) between a dielectric ( ) in the vicinity of patterned portions and a layer of a liner ( ). If the liner ( ) is perforated in the CMP process, then the undercutting of the liner ( ) by the chemical removal of the auxiliary layer ( ) simplifies the process overall. Advantages are significantly lower defect densities due to CMP scratches, fewer short circuits, fewer alignment errors.
Lahnor, Peter. (2004). Cmp process (U.S. Patent No. 6821894). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6821894
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile