The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 23, 2004

Filed:

Jun. 12, 2000
Applicant:
Inventors:

William C. Peatman, Phoenix, AZ (US);

Eric S. Johnson, Scottsdale, AZ (US);

Adolfo C. Reyes, Tempe, AZ (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/1338 ;
U.S. Cl.
CPC ...
H01L 2/1338 ;
Abstract

A method of manufacturing a semiconductor component includes providing a substrate ( ) with a surface ( ), providing a layer ( ) of undoped gallium arsenide over the surface of the substrate, forming a gate contact ( ) over a first portion of the layer, and removing a second portion of the layer.


Find Patent Forward Citations

Peatman, William. (2004). Method of manufacturing a semiconductor component and semiconductor component thereof (U.S. Patent No. 6821829). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6821829

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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