The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 23, 2004
Filed:
Jun. 13, 2003
Daniel A. Lawlyes, Kokomo, IN (US);
Delphi Technologies, Inc., Troy, MI (US);
Abstract
A method and assembly ( ) for conducting heat from a semiconductor device, such as a power flip chip ( ). The assembly ( ) is generally constructed to dissipate heat from the flip chip ( ) when mounted to a flexible or rigid substrate ( ). Heat is conducted from the flip chip ( ) through upper and lower pedestals ( ) each of which includes a pliable pre-cured silicone adhesive pad ( ). The pre-cured silicon adhesive pads ( ) promote thermal contact while also decoupling any lateral mechanical strains that may arise as a result of different thermal expansion and movement between the flip chips ( ). The housing portions ( ) form a housing ( ) when assembled, with each housing portion ( ) including a configured edge ( ) that controls the travel of the pedestals ( ) toward each other, to thereby limit the pressure exerted on the flip chip ( ) disposed therebetween. Silicone adhesive can be applied between the edges ( ) to hold the housing portions ( ) together.