The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 23, 2004

Filed:

Jul. 19, 2002
Applicant:
Inventors:

Zhihong Mai, Singapore, SG;

Jiann Min Chin, Singapore, SG;

Lihong Cao, Singapore, SG;

Assignee:

Advanced Micro Devices, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/166 ; G01R 3/102 ; G01N 2/500 ;
U.S. Cl.
CPC ...
H01L 2/166 ; G01R 3/102 ; G01N 2/500 ;
Abstract

For temperature cycling at a material of an IC (integrated circuit) package, a laser beam is directed to the material such that the material absorbs the laser beam to become heated. A laser controller adjusts at least one property of the laser beam until the temperature of the material reaches a predetermined high-end temperature. The present invention may be used for a flip-chip IC package with the laser beam being directed toward a back-side of an IC die that is exposed on the IC package. In that case, the laser beam is comprised of light having a wavelength that is within a transmission region of a semiconductor material of the IC die such that the laser beam reaches the material on the front side of the IC die.


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