The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 23, 2004
Filed:
Jan. 28, 2003
Applicant:
Inventors:
Miki Takada, Fuji, JP;
Mitsunori Matsushima, Fuji, JP;
Assignee:
Polyplastics Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 1/508 ;
U.S. Cl.
CPC ...
B32B 1/508 ;
Abstract
Tenacity of a high-molecular polyacetal resin is improved and stress relaxation thereof is also made to easily take place whereby there is provided a polyacetal resin composition in which a creep rupture life (creep characteristic) of polyacetal resin in a metal insert molding, etc. is significantly improved. (A) polyacetal resin having a melt index of 3.0 or less is compounded with (B) 0.05 to 3.0% by weight (in the composition) of silicone oil, (C) 0.1 to 5.0% by weight (in the composition) of elastomer and (D) 0.1 to 5.0% by weight (in the composition) of ultrahigh-molecular weight polyethylene.