The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 23, 2004
Filed:
Jul. 31, 2002
Applicant:
Inventors:
Jane Bell, Solingen, DE;
Joachim Heyer, Neunkrichen-Seelscheid, DE;
Jürgen Hupe, Langenfeld, DE;
Ingo Kalker, Solingen, DE;
Marlies Kleinfeld, Wuppertal, DE;
Assignee:
Enthone Inc., West Haven, CT (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 1/831 ;
U.S. Cl.
CPC ...
C23C 1/831 ;
Abstract
The invention describes a process for non-galvanic tin plating of copper and copper alloys by precipitation of tin from methanesulphonic acid and tin-containing electrolytes, containing a complexing agent. In describing a process by which a durable tin layer which can be soldered is a created, which, at the same time, prevents liberation of the base material, this invention discloses that the electrolytes have at least one foreign metal added to form a diffusion barrier in the layer.