The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2004
Filed:
Jan. 16, 2003
Kazuhiro Masuda, Suwa, JP;
Seiko Epson Corporation, , JP;
Abstract
A Cu wiring member containing Cu as the main component is embedded in an interlayer dielectric film among multiple wiring layers accompanied with a coating of a barrier metal and an upper diffusion barrier layer formed thereon. The interlayer dielectric film is composed of a first dielectric film that forms a major part thereof and a second dielectric film that is provided adjacent to the first dielectric film and forms side walls of the Cu wiring member. The first dielectric film and the second dielectric film have mutually different etching selection ratios. When a wiring layer in an upper layer is connected to the Cu wiring member through the via hole VH formed in the first dielectric film by etching, a substantial matching margin can be expected.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile