The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2004
Filed:
Dec. 04, 2001
Hitachi Cable, Ltd., Tokyo, JP;
Abstract
In a BGA type semiconductor device wherein, while leaving a via hole for a solder ball, an insulating film formed of a photosolder resist (PSR) is provided on a tape substrate on its side where a wiring pattern is provided, a groove portion is provided between a bonding wire sealing portion and the via hole for a solder ball. The groove portion is a smaller-thickness portion of the insulating film provided as a part of the insulating film. By virtue of this construction, at the time of sealing of a wire bonding connection with a mold resin, the flow of the mold resin into the via hole for a solder ball can be prevented.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile