The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2004
Filed:
Oct. 23, 2001
Yuichiro Ikenaga, Kanagawa, JP;
Yasushi Otsuka, Kanagawa, JP;
Sony Corporation, , JP;
Abstract
An IC (semiconductor device) comprises a package substrate provided on its face side with a plurality of wiring patterns such as electrode lands and wirings and provided on its back side with a plurality of electrode bumps corresponding to the wiring patterns, an IC chip mounted on the face side of the package substrate in a face-up manner, a sealing resin sealing the IC chip, and an indication provided on the back side of the package substrate for indicating the position of the IC chip. A method of inspecting a failure reason in the case of some failure of the IC chip comprises the steps of forming an opening by removing from the back side the package substrate in the region surrounded by the indication, mounting the IC chip on a test substrate, passing an electric current to the IC chip for operation, and inspecting and analyzing the reason of failure by a photo-emission analyzing method. The photo-emission analysis can be conducted without processing an upper layer wiring portion or the like of the IC chip.