The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2004
Filed:
Jan. 21, 2003
Yoshinori Oda, Nagano, JP;
Atsushi Maruyama, Nagano, JP;
Fuji Electric Co., Ltd., Kawasaki, JP;
Abstract
A lead frame for a resin-molded semiconductor device is provided with die pads for separately mounting chips of power elements and a control IC thereon; terminal leads arranged in a row at one side and including leads for the die pads, and a main circuit, a control power supply and signal circuit separated from the die pads; and a dam bar connecting the terminal leads. In the main circuit terminals and control power supply terminals, a plurality of leads is formed and drawn in advance. After the lead frame is set in a mold die and is resin-molded, certain leads that are not used as the terminal leads are selected among the plurality of the leads, and the certain leads are cut and removed together with the dam bar.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile