The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2004
Filed:
Oct. 30, 2002
Tetsuro Asano, Oizumi-machi, JP;
Mikito Sakakibara, Menuma-machi, JP;
Hideyuki Inotsume, Oizumi-machi, JP;
Haruhiko Sakai, Ota, JP;
Shigeo Kimura, Nitta-machi, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Abstract
A semiconductor device includes four input terminals, four leads extending from the corresponding input terminals and a semiconductor chip that has a first circuit and a second circuit and is mounted on one of the leads. The lead having the semiconductor chip thereon bends in a plane of the substrate so that an end portion and a mid portion of the lead are exposed on one side of the semiconductor chip. One of the input electrode pads of the first circuit is connected to the end portion of the lead by a bonding wire. The end portion of the lead is on the opposite side of the mid portion of the lead with respect to one of the leads that is connected to one of the input electrode pads of the second circuit by a bonding wire. This configuration achieves a crossing wiring structure within the packaging. By changing the connection of bonding wires, the crossing wiring structure is easily undone.