The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2004
Filed:
Sep. 05, 2002
Rintaro Yamamoto, Kyoto, JP;
Shin Nakamura, Moriyama, JP;
Tsutomu Nishine, Moriyama, JP;
Toshihiko Yoshida, Uji, JP;
Shimadzu Corporation, Kyoto, JP;
Abstract
A micro array chip is formed by high-speed in jection molding. A chip body has a thickness of 1 mm and each well has a capacity of 1.2 &mgr;L with the bottom having a wall thickness of 250 &mgr;m. An opening of each well is surrounded by an annular protrusion part, which is raised from a surface of the chip body by a height of 200 &mgr;m. The openings of wells may be closed with a sheet of sealant made of aluminum or a resin. An overall shape of the micro array chip is rectangular and is a flat plate with a level bottom surface. Therefore, the micro array chip can be used with a heat block in flat plate form, which is independent of chip specifications such as a number of wells and their shape.